Development of Pb-Free Nanocomposite Solder Alloys
Author:
Publisher
MDPI AG
Subject
General Medicine
Link
http://www.mdpi.com/2504-477X/2/2/28/pdf
Reference26 articles.
1. Sn-Ag-Cu solders and solder joints: Alloy development, microstructure, and properties
2. Nanoindentation of lead-free solders in microelectronic packaging
3. Coarsening mechanisms, texture evolution and size distribution of Cu6Sn5 between Cu and Sn-based solders
4. Deformation behavior of (Cu, Ag)–Sn intermetallics by nanoindentation
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2. Advances in the Science and Engineering of Metal Matrix Nanocomposites: A Review;Advanced Engineering Materials;2024-07-31
3. Tensile, hardness and microstructural properties of Sn-Pb solder alloys;Materials Today: Proceedings;2021
4. Distribution and Microstructure Analysis of Ceramic Particles in the Lead-Free Solder Matrix;Crystal Research and Technology;2020-10-12
5. A review: microstructure and properties of tin-silver-copper lead-free solder series for the applications of electronics;Soldering & Surface Mount Technology;2019-10-14
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