Nanoindentation of lead-free solders in microelectronic packaging
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference20 articles.
1. Issues in the replacement of lead-bearing solders
2. Converting to lead-free solders: An automotive industry perspective
3. Mechanical Properties and Microstructure of Tin-Silver-Bismuth Lead-Free Solder
4. Creep behavior of eutectic Sn–Ag lead-free solder alloy
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3. Hypo-eutectic microstructure formation and nanomechanical response in Sn-3.0Ag-0.5Cu solder balls: Effects of undercooling;Materials Characterization;2023-04
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