1. Data taken from Metals Handbook, 9th ed., vol. 6 (Materials Park, OH: ASM, 1983).
2. T.-Y. Pan and W.L. Winterbottom, “Thermal Cycling Induced Plastic Deformation in Solder Joints,” ASME Proceedings 90-WA/EEP-13, Dallas (November 1990).
3. T.-Y. Pan, “Thermal Cycling Induced Plastic Deformation in Solder Joints, Part III: Strain-Energy Based Fatigue Life Model and Effects of Ramp Rate and Hold Time,” ASME Proceedings 91-WA-EEP-10, Atlanta (December 1991).
4. Y.-H. Pao, “Measurement of Mechanical Behavior of High Lead Lead-Tin Solder Joints Subjected to Thermal Cycling,” J. Electronic Packaging, 114 (June 1992), p. 135.
5. P.M. Hall and W.M. Sherry, “Materials, Structures and Mechanics of Solder Joints for Surface-Mount Microelectronics Technology,” Proceedings of Conference of Interconnection Technology in Electronics (W. Germany: Felbach, 1986), pp. 47–61.