Effect of rapid solidification on mechanical properties of a lead free Sn–3.5Ag solder
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference22 articles.
1. Developing lead-free solders: A challenge and opportunity
2. Converting to lead-free solders: An automotive industry perspective
3. Proc. 1992 Int. Electron. Manufact. Symp., vol. 300;Felton,1992
4. Proc. 1993 IEEE Int. Symp. Electron. Environ., vol. 94;Melton,1993
5. Strength of tin-based soldered joints
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