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Mechanical Properties and Microstructure of Tin-Silver-Bismuth Lead-Free Solder

  • Published:2002 Issue:8 Volume:43 Page:1808-1815
  • ISSN:1345-9678
  • Container-title:MATERIALS TRANSACTIONS
  • language:en
  • Short-container-title:Mater. Trans.

Author:

Shimokawa Hanae1,Soga Tasao1,Serizawa Koji1

Affiliation:

1. Packaging Technology Center, Production Engineering Research Laboratory, Hitachi Ltd.

Publisher

Japan Institute of Metals

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

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2. Effect of Aging Time on Ductile–Brittle Transition Behaviors of Sn-3.5Ag Solder;Journal of Electronic Materials;2022-10-26

3. Bismuth;Handbook on the Toxicology of Metals;2022

4. Study on interface of Sn-Ag-Zn lead free solder with low silver content;Journal of Physics: Conference Series;2021-04-01

5. Effect of Bi and Cu Element in Lead Free Solders During Multiple Reflow Process;Reference Module in Materials Science and Materials Engineering;2019
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