Coarsening mechanisms, texture evolution and size distribution of Cu6Sn5 between Cu and Sn-based solders
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference19 articles.
1. Lead-free Solders in Microelectronics
2. Interfacial reactions between molten Sn–Bi–X solders and Cu substrates for liquid solder interconnects
3. Sn–0.7wt.%Cu/Ni interfacial reactions at 250°C
4. Effect of Cu addition on interfacial reaction between Sn–9Zn solder and Ag
5. Interfacial reactions and shear strength on Cu and electrolytic Au/Ni metallization with Sn-Zn solder
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2. IMC microstructure modification and mechanical reinforcement of Sn–Ag–Cu/Cu microelectronic joints through an advanced surface finish technique;Journal of Materials Research and Technology;2021-03
3. Electrochemically enhanced Cu6Sn5 anodes with tailored crystal orientation and ordered atomic arrangements for lithium-ion battery applications;Acta Materialia;2020-12
4. The influence of the crystallographic structure of the intermetallic grains on tin whisker growth;Journal of Alloys and Compounds;2019-05
5. General model on position of the solid/liquid interface during preparation of a directionally solidified peritectic alloy containing intermetallic compound phases;Materials Chemistry and Physics;2019-02
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