1. W.J. Plumbridge, C.R. Gagg, and S. Peters, “ The Creep of Lead-free Solders at Elevated Temperatures,”J. Electronic Materials, 30 (9) (2001), pp. 1178–1183.
2. “ What Else is in the Refrigerator?”Consumer Reports (February 1994), p. 100.
3. C.M. Miller, “ Development of a new Pb-free solder: Sn-Ag-Cu” (Master of Science Thesis, Iowa State University, 1994).
4. Challenges and Efforts Toward Commercialization of Lead-free Solder-Road Map 2000 for Commercialization of Lead-free Solder, ver. 1.2 (The Japan Electronic Industry Development Association, Leadfree Soldering R&D Project Committee, February 2000);www.jeida.or.jp/english/information/pbfree/ roadmap.html.
5. J. Bath, C. Handweker, and E. Bradley, “ Research Update: Lead-free Solder Alternatives,”Circuits Assembly (May 2000), pp. 31–40.