Author:
Chen Gang,Hu Tao,Xie Mingwei,Yang Jing,Xu Weiling
Funder
National Natural Science Foundation of China
Subject
Mechanics of Materials,General Materials Science,Instrumentation
Reference43 articles.
1. Unified viscoplasticity modeling for isothermal low-cycle fatigue and fatigue-creep stress-strain responses of Haynes 230;Ahmed;Int. J. Solids Struct.,2016
2. Constitutive modeling for thermo-mechanical low-cycle fatigue-creep stress–strain responses of Haynes 230;Ahmed;Int. J. Solids Struct.,2017
3. Ahmed, S., Suhling, J.C., Lall, P., 2017. The anand Anand parameters of aging resistant doped solder alloys. 1416–1424. 10.1109/ITHERM.2017.7992647.
4. Constitutive equations for hot-working of metals;Anand;Int. J. Plast.,1985
5. Sn–Ag–Cu solders and solder joints: alloy development, microstructure, and properties;Anderson;JOM,2002
Cited by
13 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献