The Wiedemann–Franz–Lorenz relation for lead-free solder and intermetallic materials
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Polymers and Plastics,Ceramics and Composites,Electronic, Optical and Magnetic Materials
Reference29 articles.
1. Current density redistribution from no current crowding to current crowding in Pb-free solder joints with an extremely thick Cu layer
2. Mechanism for serrated cathode dissolution in Cu/Sn/Cu interconnect under electron current stressing
3. Mechanical properties of Pb-free SnAg solder joints
4. Recent advances of conductive adhesives as a lead-free alternative in electronic packaging: Materials, processing, reliability and applications
5. Influence of Cu column under-bump-metallizations on current crowding and Joule heating effects of electromigration in flip-chip solder joints
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