Minor Ag induced shear performance alternation in BGA structure Cu/SnBi/Cu solder joints under electric current stressing
Author:
Publisher
Elsevier BV
Subject
Metals and Alloys,Surfaces, Coatings and Films,Biomaterials,Ceramics and Composites
Reference45 articles.
1. Electromigration in three-dimensional integrated circuits;Shen;Appl Phys Rev,2023
2. A new current crowding phenomenon for flip-chip-on-leadframe (FCOL) package and its impact on electromigration reliability;Ankamah-Kusi,2022
3. Electromigration analysis of solder joints for power modules using an electrical-thermal-stress-atomic coupled model;Kato;J Electron Packag,2023
4. Effect of electric current stressing on mechanical performance of solders and solder joints: a review;Wang;J Mater Sci,2022
5. The failure of Sn-Bi-based solder joints due to current stressing;Hadian;J Electron Mater,2023
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1. Influence of nickel plating on the welding metallurgical mechanism, microstructure, and shear performance of C101/80Au20Sn/C101 solder joints;Materials Characterization;2024-09
2. Facile synthesis of Cu-Sn nanoparticle film and its bonding mechanism for power electronic packaging;Journal of Materials Processing Technology;2024-08
3. Impact of Co on Thermal Aging in Sn58Bi/Cu Solder Joints: IMC Growth and Transformation in Mechanical Properties;Metals and Materials International;2024-05-18
4. Intermetallic compound growth behavior and mechanical performance in Sn58Bi/Cu solder joint bearing Mg particles incorporation during thermal aging;Materials Characterization;2024-02
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