New formation process of plating thin films on several substrates by means of self-assembled monolayer (SAM) process
Author:
Publisher
Elsevier BV
Subject
Electrochemistry,General Chemical Engineering
Reference24 articles.
1. Damascene copper electroplating for chip interconnections
2. A Chemical Reaction Path Design for the Atomic Layer Deposition of Tantalum Nitride Thin Films
3. Improved barrier properties of ultrathin Ru film with TaN interlayer for copper metallization
4. High aspect ratio quarter-micron electroless copper integrated technology
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