Funder
National Research Foundation of Korea
Korea Institute of Energy Research
Publisher
The Electrochemical Society
Subject
Electronic, Optical and Magnetic Materials
Reference46 articles.
1. Kumbhat N. Raj P. M. Pucha R. V. Atmur S. Doraiswamy R. Sundaram V. Bhattacharya S. Sitaraman S. K. Tummala R. R. , “Recent advances in ceramic composite substrate materials for high-density and high reliability packaging applications,” in: Electronic Components and Technology Conference, 2005. Proceedings. 55th, IEEE, pp. 1364–1372 (2005).
2. Thermal conductivity of ceramic particle filled polymer composites and theoretical predictions
3. An improved design of double-layered microchannel heat sink with truncated top channels
4. Cooling performance of MEPCM suspensions for heat dissipation intensification in a minichannel heat sink
5. Optimization of thermal design of heat sinks: A review
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献