The design of nano-porous photocatalytic intermediate layer to fabricate the copper layer on AlN ceramic with high bonding strength through the interlocking microstructure-Reference-Cited by-同舟云学术

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The design of nano-porous photocatalytic intermediate layer to fabricate the copper layer on AlN ceramic with high bonding strength through the interlocking microstructure

Published:2024-11 Issue: Volume:703 Page:135140
ISSN:0927-7757
Container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects
language:en
Short-container-title:Colloids and Surfaces A: Physicochemical and Engineering Aspects

Author:

Yang Jifan,Yang Yuxuan,Long Fei,Li Xuan,Sun Fei,Qian Chenhao,Yan Xinyu,Zhou Tong,Liu Lei

Funder

National Key Research and Development Program of China

National Natural Science Foundation of China

Special Project for Research and Development in Key Areas of Guangdong Province

Publisher

Elsevier BV

Reference48 articles.

1. Improved adhesion of metal electrode layer on Si3N4 substrate through an all-wet process;Kim;ECS J. Solid State Sci. Technol.,2019

2. Formation of micrometer scale metal structures on glass by selective electroless plating on photopatterned titanium and copper containing films;Cordonier;Langmuir,2017

3. Direct bonding of silicon nitride to copper via laser surface modification;Song;Appl. Surf. Sci.,2022

4. A facile process to manufacture high performance copper layer on ceramic material via biomimetic modification and electroless plating;Wang;Compos. B Eng.,2019

5. Effect of copper- and silver-based films on alumina substrate electrical properties;Reboun;Ceram. Int.,2018

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