Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging-Reference-Cited by-同舟云学术

Low-temperature hermetic thermo-compression bonding using electroplated copper sealing frame planarized by fly-cutting for wafer-level MEMS packaging

Published:2018-08 Issue: Volume:279 Page:671-679
ISSN:0924-4247
Container-title:Sensors and Actuators A: Physical
language:en
Short-container-title:Sensors and Actuators A: Physical

Author:

Al Farisi Muhammad Salman,Hirano Hideki,Tanaka Shuji

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Metals and Alloys,Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation,Electronic, Optical and Magnetic Materials

Reference36 articles.

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3. Overview and development trends in the field of MEMS packaging;Reichl;Tech. Dig. MEMS 2001 14th IEEE Int. Conf. Micro Electro Mech. Syst.,2001

4. Wafer level packaging of MEMS;Esashi;J. Micromech. Microeng.,2008

5. Wafer level encapsulation of microsystems using glass frit bonding;Knechtel;Microsyst. Technol.,2006

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