Stacked Integration of MEMS on LSI
Author:
Publisher
MDPI AG
Subject
Electrical and Electronic Engineering,Mechanical Engineering,Control and Systems Engineering
Link
http://www.mdpi.com/2072-666X/7/8/137/pdf
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1. Heterogeneous integration by adhesive bonding;Esashi;Micro Nano Syst. Lett.,2013
2. Wafer level packaging of MEMS;Esashi;J. Micromech. Microeng.,2008
3. Wafer-Level Heterogeneous Integration for MOEMS, MEMS, and NEMS
4. Wafer-to-Wafer Alignment for Three-Dimensional Integration: A Review
5. LED array integrated with Si driving circuits for LED printer printhead
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