Wafer level encapsulation of microsystems using glass frit bonding
Author:
Publisher
Springer Science and Business Media LLC
Subject
Electrical and Electronic Engineering,Hardware and Architecture,Condensed Matter Physics,Electronic, Optical and Magnetic Materials
Link
http://link.springer.com/content/pdf/10.1007/s00542-005-0036-4.pdf
Reference2 articles.
1. Simon I “Sensorverkapselung: Messtechnische Untersuchungen” HSG-IMIT Report BMBF-Project MANGHO
2. Moraja M, Amiotti A, Longini G (2003) Patterned getter film wafers for wafer level packaging of MEMS. Micro System Technologies München
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