Microstructure and mechanical strength of Cu/Sn/Cu microbump via Ni and Zn doping into Cu substrate
Author:
Funder
Ministry of Science and Technology, Taiwan
National Tsing Hua University
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference38 articles.
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3. Extremely rapid grain growth in scallop-type Cu6Sn5 during solid–liquid interdiffusion reactions in micro-bump solder joints;Gusak;Scripta Mater.,2020
4. Relationship between morphologies and orientations of Cu6Sn5 grains in Sn3.0Ag0.5Cu solder joints on different Cu pads;Tian;Mater. Char.,2014
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2. Retaining multi-oriented and fine grain structure with Ni doping in Cu/Sn-3.0Ag-0.5Cu/Cu transient liquid phase bonding under isothermal aging treatment;Materials Chemistry and Physics;2023-09
3. Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics;Materials Science and Engineering: A;2023-08
4. Effect of nano-intermetallic compound on creep properties and β-Sn grain recrystallization of Cu/Sn-Ag-Cu/Ni solder joints;Materials Today Communications;2023-08
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