Author:
Magnien J.,Khatibi G.,Lederer M.,Ipser H.
Funder
Austrian Federal Government
Christian Doppler Forschungsgesellschaft
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference34 articles.
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4. G. Khatibi, H. Ipser, M. Lederer, B. Weiss, Influence of miniaturization on mechanical reliability of lead-free solder interconnects, in: K.N. Subramanian (Ed.), Lead-Free Solders: Materials Reliability for Electronics, Wiley Blackwell, 2012, pp. 445–485.
5. I.E. Anderson, Development of Sn-Ag-Cu and Sn-Ag-Cu-X alloys for Pb-free electronic solder applications, in: K.N. Subramanian (Ed.), Lead-Free Electronic Solders: A Special Issue of the Journal of Materials Science: Materials in Electronics, Springer US, Boston, MA, 2007, pp. 55–76.
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