Holistic Material Design for Reliability of Electronic Based Systems
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Publisher
Springer Science and Business Media LLC
Link
https://link.springer.com/content/pdf/10.1007/s00501-024-01457-5.pdf
Reference25 articles.
1. Wu, W.-F., Lu, Y.-A.: Reliability of electronic packaging BT. In: Pham, H. (ed.) Springer handbook of engineering statistics, pp. 1003–1023. Springer, London (2023) https://doi.org/10.1007/978-1-4471-7503-2_50
2. Liu, Y.: Power electronic packaging—design, assembly process, reliability and modeling, 1st edn. Springer, New York (2014). https://doi.org/10.1007/978-1-4614-1053-9
3. Padurariu, L., et al.: Analysis of local vs. macroscopic properties of porous BaTiO3 ceramics based on 3D reconstructed ceramic microstructures. Acta Mater 255, 119084 (2022). https://doi.org/10.1016/j.actamat.2023.119084
4. Sinojiya, R.J., et al.: Probing the composition dependence of residual stress distribution in tungsten-titanium nanocrystalline thin films. Commun. Mater. 4(1), 1–12 (2023). https://doi.org/10.1038/s43246-023-00339-6
5. Mitterhuber, L., et al.: Anomalous thermal conductivity in amorphous niobium pentoxide thin films: a correlation study between structure and thermal properties. Materialia 26, 101601 (2022). https://doi.org/10.1016/j.mtla.2022.101601
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