Bump height confinement governed solder alloy hardening in Cu/SnAg/Ni and Cu/SnAgCu/Ni joint assemblies
Author:
Publisher
Elsevier BV
Subject
Materials Chemistry,Metals and Alloys,Mechanical Engineering,Mechanics of Materials
Reference20 articles.
1. Size and Volume Effects on the Strength of Microscale Lead-Free Solder Joints
2. Effects of solder dimension on the interfacial shear strength and fracture behaviors of Cu/Sn–3Cu/Cu joints
3. Critical Concerns in Soldering Reactions Arising from Space Confinement in 3-D IC Packages
4. Precipitation of large Ag3Sn intermetallic compounds in SnAg2.5 microbumps after multiple reflows in 3D-IC packaging
5. Thermal-gradient induced abnormal Ni3Sn4 interfacial growth at cold side in Sn2.5Ag alloys for three-dimensional integrated circuits
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1. Microstructure and mechanical strength of Cu/Sn/Cu microbump via Ni and Zn doping into Cu substrate;Materials Chemistry and Physics;2023-04
2. Enhancing mechanical properties via adding Ni and Zn in Cu/Sn3.5Ag/Cu transient liquid phase bonding for advanced electronic packaging;Journal of Materials Science: Materials in Electronics;2022-01-16
3. Microstructure and properties of Sn-Ag and Sn-Sb lead-free solders in electronics packaging: a review;Journal of Materials Science: Materials in Electronics;2021-12-01
4. Critical Review of Size Effects on Microstructure and Mechanical Properties of Solder Joints for Electronic Packaging;Applied Sciences;2019-01-10
5. Multi-objective optimization on laser solder jet bonding process in head gimbal assembly using the response surface methodology;Optics & Laser Technology;2018-01
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