Precipitation of large Ag3Sn intermetallic compounds in SnAg2.5 microbumps after multiple reflows in 3D-IC packaging
Author:
Publisher
Elsevier BV
Subject
Condensed Matter Physics,General Materials Science
Reference18 articles.
1. Six cases of reliability study of Pb-free solder joints in electronic packaging technology
2. Effects of intermetallic compounds on properties of Sn–Ag–Cu lead-free soldered joints
3. Retarding growth of Ni3P crystalline layer in Ni(P) substrate by reacting with Cu-bearing Sn(Cu) solders
4. Evolution of interfacial morphology of Sn–8.5Zn–0.5Ag–0.1Al–xGa/Cu system during isothermal aging
5. Thermodynamic properties and phase equilibria of Sn–Bi–Zn ternary alloys
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1. Advanced Flip Chip Packaging;Springer Series in Reliability Engineering;2023
2. Effect of Tin Grain Orientation on Electromigration-Induced Dissolution of Ni Metallization in SnAg Solder Joints;Materials;2022-10-13
3. Effect of Intermetallic Compound Bridging on the Cracking Resistance of Sn2.3Ag Microbumps with Different UBM Structures under Thermal Cycling;Metals;2021-07-01
4. An effective method to retard Cu–Sn intermetallic compounds formation on the sidewall of microbumps by thermal oxidation;Materials Chemistry and Physics;2020-12
5. Inhibition of intermetallic compounds growth at Sn–58Bi/Cu interface bearing CuZnAl memory particles (2–6 μm);Journal of Materials Science: Materials in Electronics;2020-01-02
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