Relationship between morphologies and orientations of Cu6Sn5 grains in Sn3.0Ag0.5Cu solder joints on different Cu pads
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference22 articles.
1. Nanomechanical responses of intermetallic phase at the solder joint interface — crystal orientation and metallurgical effects;Song;Mater Sci Eng A Struct,2012
2. Anisotropic mechanical properties of Cu6Sn5 and (Cu, Ni)6Sn5;Mu;Mater Lett,2012
3. Towards elastic anisotropy and strain-induced void formation in Cu–Sn crystalline phases;Chen;Microelectron Reliab,2009
4. Young's modulus of (Cu, Ag)–Sn intermetallics measured by nanoindentation;Deng;Mater Sci Eng A Struct,2004
5. Deformation behavior of (Cu, Ag)–Sn intermetallics by nanoindentation;Deng;Acta Mater,2004
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1. Insight into the improvement of service performance of Sn/Cu solder joint by Pt doping in Cu6Sn5 interfacial intermetallic compound;Materials Today Communications;2024-03
2. Grain orientations and failure mechanism of isothermal aged nano Sn-3Ag-0.5Cu/Cu solder joints by microwave hybrid heating and shear mechanical strength;Engineering Fracture Mechanics;2024-03
3. The In-Situ TEM Isothermal Aging Evolution in a µ-Cu/NiAu/Sn/Cu Solder Joint for Full Intermetallic Compounds Interconnects of Flexible Electronics;Electronic Materials Letters;2023-12-12
4. Study on Cu6Sn5 morphology and grain orientation transition at the interface of (111) nt-Cu and liquid Sn;Journal of Materials Research and Technology;2023-09
5. Co, In, and Co–In alloyed Cu6Sn5 interconnects: Microstructural and mechanical characteristics;Materials Science and Engineering: A;2023-08
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