Anisotropic mechanical properties of Cu6Sn5 and (Cu,Ni)6Sn5
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference28 articles.
1. Interfacial reactions between lead-free solders and common base materials
2. Failure mechanisms of solder interconnects under current stressing in advanced electronic packages
3. Mechanical properties of Pb-free SnAg solder joints
4. Young’s modulus of (Cu, Ag)–Sn intermetallics measured by nanoindentation
5. First-principles calculations of structural and mechanical properties of Cu6Sn5
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1. Microstructure modification and mechanical reinforcement in sub-10 μm scale Cu/Sn–Ag/Cu microbump joints via Co-addition of Zn and Ni in Cu substrates;Materials Chemistry and Physics;2024-11
2. Effect of Ag Doping on Mechanical Properties of Cu6Sn5 Intermetallic Compounds;Metals;2024-06-07
3. Nucleation and growth of Cu6Sn5 during the aging process of Cu/Sn interface in electronic packaging-by in-situ TEM;Acta Materialia;2024-01
4. Alteration of Cu3Sn growth and retention of multi-orientation Cu6Sn5 during thermal aging in Cu-xNi-yZn/Sn3.5Ag/Cu transient liquid-phase bonding;Materials Characterization;2024-01
5. Microstructural and mechanical analysis of Cu/Sn/Cu microbump by doping Ni and Zn into Cu substrate;2023 IEEE 25th Electronics Packaging Technology Conference (EPTC);2023-12-05
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