Microstructure and chemistry of the SAC/ENIG interconnections-Reference-Cited by-同舟云学术

Microstructure and chemistry of the SAC/ENIG interconnections

Published:2013-04 Issue:1 Volume:139 Page:276-280
ISSN:0254-0584
Container-title:Materials Chemistry and Physics
language:en
Short-container-title:Materials Chemistry and Physics

Author:

Wojewoda-Budka J.,Huber Z.,Litynska-Dobrzynska L.,Sobczak N.,Zieba P.

Publisher

Elsevier BV

Subject

Condensed Matter Physics,General Materials Science

Reference16 articles.

1. Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

2. An Embrittlement Mechanism of Impact Fracture of Sn–Ag–Cu Solder Joints on BGA Using Electroplated Ni/Au Surface Finishes

3. C.K. Meng, T.S. Selvamuniandy, C. Gurumurthy, Discoloration related failure mechanism and its root cause in electroless nickel immersion gold (ENIG) pad metallurgical surface finish, in: Proceedings of the 11th International Symposium on the Physical and Failure Analysis of Integrated Circuits, 2004, pp. 229–233.

4. Reliability of BGA Solder Joints on the Au/Ni/Cu Bond Pad-Effect of Thicknesses of Au and Ni Layer

5. Six cases of reliability study of Pb-free solder joints in electronic packaging technology

Cited by 18 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. An analytical review on interfacial reactions in high-temperature die-attach: The insights into the effect of surface metallization and filler materials;MATEC Web of Conferences;2024

2. Cu aggregation behavior on interfacial reaction of Sn-3.0Ag-0.5Cu/ENIG solder joints;Materials Letters;2023-10

3. Reactivity with tin and corrosion resistance of electroless Ni-P and Ni-P-Re coatings plated on copper;Electrochimica Acta;2022-02

4. Comparative study between the Sn–Ag–Cu/ENIG and Sn–Ag–Cu/ENEPIG solder joints under extreme temperature thermal shock;Journal of Materials Science: Materials in Electronics;2021-02-16

5. Intermetallic Compounds;Lead‐free Soldering Process Development and Reliability;2020-07-03