Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint-Reference-Cited by-同舟云学术

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Comparative Study of ENIG and ENEPIG as Surface Finishes for a Sn-Ag-Cu Solder Joint

Published:2011-06-18 Issue:9 Volume:40 Page:1950-1955
ISSN:0361-5235
Container-title:Journal of Electronic Materials
language:en
Short-container-title:Journal of Elec Materi

Author:

Yoon Jeong-Won,Noh Bo-In,Jung Seung-Boo

Publisher

Springer Science and Business Media LLC

Subject

Materials Chemistry,Electrical and Electronic Engineering,Condensed Matter Physics,Electronic, Optical and Magnetic Materials

Link

http://link.springer.com/content/pdf/10.1007/s11664-011-1686-x.pdf

Reference13 articles.

1. M. Abtew and G. Selvaduary, Mater. Sci. Eng. R 27, 95 (2000).

2. C.M.L. Wu, D.Q. Yu, C.M.T. Law, and L. Wang, Mater. Sci. Eng. R 44, 1 (2004).

3. G. Milad and D. Gudeczauskas, Met. Finish. 104, 33 (2006).

4. G. Milad and M. Orduz, Met. Finish. 105, 25 (2007).

5. Y.W. Yen, P.H. Tsai, Y.K. Fang, S.C. Lo, Y.P. Hsieh, and C. Lee, J. Alloys Compd. 503, 25 (2010).

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1. Effects of soldering temperatures and composition on the microstructures and shear properties of Sn58Bi-xSAC0307/ENIG solder joints;Soldering & Surface Mount Technology;2024-07-25

2. Investigation of isothermal aged Sn-3Ag-0.5Cu/Sn58Bi-Co hybrid solder joints on ENIG and ENEPIG substrate with various mechanical performances;Materials Today Communications;2024-06

3. The doped Pd on the crystal calculation and intermetallic property of low-temperature soldered ENEPIG substrates;Journal of Materials Research and Technology;2023-11

4. The design of low-temperature solder alloys and the comparison of mechanical performance of solder joints on ENIG and ENEPIG interface;Journal of Materials Research and Technology;2023-11

5. The effect of microstructure for Ni-based surface finishing thin film on corrosion behavior;Surface and Coatings Technology;2023-03

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