Intermetallic Compounds
Author:
Publisher
Wiley
Link
https://onlinelibrary.wiley.com/doi/pdf/10.1002/9781119482093.ch12
Reference74 articles.
1. Intermetallic growth studies on Sn‐Ag‐Cu lead‐free solder joints;Pang J.H.;Journal of Electronic Materials,2004
2. Microstructural development and mechanical properties of hypereutectic Sn‐Cu solder alloys;Spinelli J.E.;Materials Science and Engineering A,2013
3. Characteristics of intermetallics and micromechanical properties during thermal ageing of Sn–Ag–Cu flip-chip solder interconnects
4. A review on the interfacial intermetallic compounds between Sn–Ag–Cu based solders and substrates
5. Experimental and thermodynamic assessment of Sn-Ag-Cu solder alloys
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