Reactivity with tin and corrosion resistance of electroless Ni-P and Ni-P-Re coatings plated on copper-Reference-Cited by-同舟云学术

Reactivity with tin and corrosion resistance of electroless Ni-P and Ni-P-Re coatings plated on copper

Published:2022-02 Issue: Volume:406 Page:139850
ISSN:0013-4686
Container-title:Electrochimica Acta
language:en
Short-container-title:Electrochimica Acta

Author:

Wojewoda-Budka Joanna,Wierzbicka-Miernik Anna,Kwiecien Izabella,Valenza Fabrizio,Korneva Anna,Janusz-Skuza Marta,Stan-Glowinska Katarzyna,Guspiel Jan,Bugajska Monika

Publisher

Elsevier BV

Subject

Electrochemistry,General Chemical Engineering

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4. Optimal phosphorous content selection for the soldering reaction of Ni-P under bump metallization with Sn-Ag-Cu solder;Lin;J. Electron. Mater.,2006

5. Suppressing Ni–Sn–P growth in SnAgCu/Ni–P solder joints;Lin;Scr. Mater.,2007

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