Time dependence of stress and hillock distributions during electromigration in thin metal film interconnections
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science
Reference15 articles.
1. Electromigration in thin aluminum films on titanium nitride
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2. A Critical Review on the Electromigration Effect, the Electroplastic Effect, and Perspectives on the Effects of Electric Current Upon Alloy Phase Stability;JOM;2019-07-26
3. Study of pretreatment prior to silicon-oxycarbide deposition on Cu interconnect;Journal of Vacuum Science & Technology B: Microelectronics and Nanometer Structures;2008
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5. Fractal analysis of electromigration-induced changes of surface topography in Au conductor lines;Surface Science;2003-02
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