The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering-Reference-Cited by-同舟云学术

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The effect of Bi on the microstructure, electrical, wettability and mechanical properties of Sn-0.7Cu-0.05Ni alloys for high strength soldering

Published:2020-01 Issue: Volume:186 Page:108281
ISSN:0264-1275
Container-title:Materials & Design
language:en
Short-container-title:Materials & Design

Author:

Ramli M.I.I.,Mohd Salleh M.A.A.,Yasuda H.,Chaiprapa J.,Nogita K.

Funder

Universiti Malaysia Perlis

fundamental research grant scheme

Ministry of Higher Education, Malaysia

Grant-in-Aid for Scientific Research

JSPS

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,General Materials Science

Reference55 articles.

1. formation of intermetallics in Sn-0.9Cu and Sn-0.7Cu-0.08Ni solders;Ventura;J. Electron. Mater.,2011

2. Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0. 7Cu solders on Cu substrates;Salleh;J. Mater. Process. Technol.,2017

3. Effect of Ni addition on the wettability and microstructure of Sn2.5Ag0.7Cu0.1RE solder alloy;Wang;Mater. Des.,2017

4. Effect of Ni to the Cu substrate on the interfacial reaction with Sn-Cu solder;Maeshima;Mater. Des.,2016

5. Physical properties of Sn58Bi-xNi lead-free solder and its interfacial reaction with copper substrate;Kanlayasiri;Mater. Des.,2015

Cited by 43 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Reliability Risk Mitigation in Advanced Packages by Aging-Induced Precipitation of Bi in Water-Quenched Sn–Ag–Cu–Bi Solder;Materials;2024-07-21

2. A Non-destructive Evaluation of Microstructural Analysis in Sn-Ag-Cu Solder Joint by Synchrotron X-Ray Radiation Tomography;Archives of Metallurgy and Materials;2024-06-21

3. Influence of bismuth addition on the physical and mechanical properties of low silver/lead-free Sn-Ag-Cu solder;Materials Today Communications;2024-06

4. Mechanical property optimization of Sn-1.5Ag-0.5Cu solder alloys with additions of Bi, In, and Te;Physica Scripta;2024-05-24

5. Enhance mechanical property and electrical conductivity simultaneously of Sn–Cu–Co solder alloys by directional solidification;Journal of Materials Research and Technology;2024-03

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