A Non-destructive Evaluation of Microstructural Analysis in Sn-Ag-Cu Solder Joint by Synchrotron X-Ray Radiation Tomography-Reference-Cited by-同舟云学术

A Non-destructive Evaluation of Microstructural Analysis in Sn-Ag-Cu Solder Joint by Synchrotron X-Ray Radiation Tomography

Published:2024-06-21 Issue: Volume: Page:661-665
ISSN:2300-1909
Container-title:Archives of Metallurgy and Materials
language:pl
Short-container-title:

Author:

Tan C.Y.¹^ORCID,Mohd Salleh M.A.A.¹,Saud N.¹^ORCID,Nabialek M.²^ORCID,Rylski A.³^ORCID

Affiliation:

1. Universiti Malaysia Perlis, Centre of Excellent on Geopolymer and Green Technology (CEGeoGTech), 02600 Perlis, Malaysia

2. Czestochowa University of Technology, Department of Physics, Faculty of Production Engineering and Materials Technology,42-200 Czestochowa, Poland

3. Lodz University of Technology, Institute of Materials Science and Engineering, 90-924 Lodz, Poland

Abstract

This paper demonstrates a non-destructive technique to evaluate the internal microstructure in the Sn-Ag-Cu (SAC) solder joint through synchrotron X-ray radiation tomography. Synchrotron X-ray tomography is increasingly utilized for characterizing the internal microstructure of materials in 3D images. A 3D model is reconstructed from a set of 2D projection images taken from different angles and angular position during the sample rotation, thus it could provide a more comprehensive description of the microstructure of an alloy compared to 2D images. In this paper, it is successfully observed and evaluated the internal microstructure of a 900 μm solder joint sample. The key principles and methods of synchrotron X-ray tomography are briefly described. Examples of quantitative and qualitative assessments on the grain refinement effect of Mg addition to SAC35 solder joint are also presented in this paper.

Publisher

Polish Academy of Sciences Chancellery

Link

https://journals.pan.pl/Content/131907/AMM-2024-2-43-Tan.pdf