Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates-Reference-Cited by-同舟云学术

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Effects of Ni and TiO2 additions in as-reflowed and annealed Sn0.7Cu solders on Cu substrates

Published:2017-04 Issue: Volume:242 Page:235-245
ISSN:0924-0136
Container-title:Journal of Materials Processing Technology
language:en
Short-container-title:Journal of Materials Processing Technology

Author:

Mohd Salleh M.A.A.,McDonald S.D.,Nogita K.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Metals and Alloys,Computer Science Applications,Modeling and Simulation,Ceramics and Composites

Reference23 articles.

1. Microstructure and mechanical properties of Pb-free Sn–3. 0Ag–0. 5Cu solder pastes added with NiO nanoparticles after reflow soldering process;Chellvarajoo;Mater. Des.,2016

2. Effect of microelements addition on the interfacial reaction between Sn-Ag-Cu solders and the Cu substrate;Chuang;J. Electron. Mater.,2003

3. Strengthening mechanism of nano-Al2O3 particles reinforced Sn3.5Ag0: 5Cu lead-free solder;Chuang;J. Mater. Sci.: Mater. Electron.,2010

4. Novel SiC nanoparticles-containing Sn–1.0Ag–0.5Cu solder with good drop impact performance;El-Daly;Mater. Sci. Eng.: A,2013

5. Effect of displacement rate on bump shear properties of electroplated solder bumps in flip-chip packages;Koo;Mater. Sci. Eng.: A,2008

Cited by 55 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Effects of CuO nanoparticles on SAC composite solder joints: Microstructural and DFT study;Journal of Materials Research and Technology;2024-09

2. Evaluation of the microstructure, distribution of the intermetallic compounds, and mechanical behavior of SC07 solders with In, Ni, and TiO2 NPs minor additions;Journal of Materials Science: Materials in Electronics;2024-05

3. Evolution Mechanism of Microstructure and Mechanical Properties of Snpb Eutectic Solder Joints Induced by Gamma Rays and Electron Irradiation;2024

4. Corrosion problems of SAC-SiC composite solder alloys;Corrosion Science;2023-11

5. The Microstructural, Mechanical and Electrical Properties of Pb-Sn and Lead-Free SC0.7 Solders Containing Sub Micron Active Carbon Particles;Journal of Polytechnic;2023-08-15

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