Effect of cure shrinkage of epoxy molding compound on warpage behavior of semiconductor package

Author:

Baek Jeong-Hyeon,Park Dong-Woon,Oh Gyung-Hwan,Kawk Dong-Ok,Park Simon S.,Kim Hak-SungORCID

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference53 articles.

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4. Study of the impact of curing condition on flexural strength of a very thin semiconductor package;Talledo;Journal of Engineering Research and Reports,2021

5. Material properties sensitivity analysis based on thermomechanical analysis on warpage for ball grid array semiconductor packaging;Lim,2019

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