Enhancing predictability of thermal warpage by applying temperature-dependent Poisson's ratio of epoxy molding compound-Reference-Cited by-同舟云学术

Enhancing predictability of thermal warpage by applying temperature-dependent Poisson's ratio of epoxy molding compound

Published:2023-08 Issue: Volume:125 Page:108140
ISSN:0142-9418
Container-title:Polymer Testing
language:en
Short-container-title:Polymer Testing

Author:

Kim Junmo^ORCID,Song Myoung^ORCID,Gu Chang-Yeon^ORCID,Ma Sungwoo,Lee Jin Hee,Lee Woong-Sun,Kim Taek-Soo^ORCID

Funder

SK hynix Inc

Publisher

Elsevier BV

Subject

Polymers and Plastics,Organic Chemistry

Reference28 articles.

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4. Cure Shrinkage Characterization and Warpage Simulation Optimization of Epoxy Molding Compound for 5G Application, 2021 22nd International Conference on Electronic Packaging Technology (ICEPT);Chen,2021

5. High Reliability Solution of 2.5D Package Technologies;Lin,2021

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1. A review on warpage measurement metrologies for advanced electronic packaging;Microelectronics Reliability;2024-09

2. Evolution of epoxy molding compounds and future carbon materials for thermal and mechanical stress management in memory device packaging: a critical review;Journal of Materials Science: Materials in Electronics;2023-10

3. Thermomechanical Challenges of 2.5-D Packaging: A Review of Warpage and Interconnect Reliability;IEEE Transactions on Components, Packaging and Manufacturing Technology;2023-10