FEA simulation and modeling for fan-out package design
Author:
Affiliation:
1. Institute of Microelectronics,A-STAR
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx7/10012686/10013085/10013131.pdf?arnumber=10013131
Reference21 articles.
1. Demonstration of Vertically Integrated POP using FOWLP Approach
2. FOWLP Design for Digital and RF Circuits;teck guan;69th Electronic Components and Technology Conference (ECTC),0
3. Study on Electrical Performance and Mechanical Reliability of Antenna in Package (AIP) with Fan-Out Wafer Level Packaging Technology
4. Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging for 60 GHz WLAN Application;zihao;68th Electronic Components and Technology Conference (ECTC),0
5. Design, Process and Reliability of Face-up 2-layer molded FOWLP Antenna-in-Package
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