Design, Process and Reliability of Face-up 2-layer molded FOWLP Antenna-in-Package-Reference-Cited by-同舟云学术

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Design, Process and Reliability of Face-up 2-layer molded FOWLP Antenna-in-Package

Published:2020-06 Issue: Volume: Page:
ISSN:
Container-title:2020 IEEE 70th Electronic Components and Technology Conference (ECTC)
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Author:

Chong Chai Tai,Teck Guan Lim,Yong Han,Che F. X.,Ho Soon Wee David,Chong Ser Choong

Publisher

IEEE

Link

http://xplorestaging.ieee.org/ielx7/9151098/9159179/09159293.pdf?arnumber=9159293

Cited by 13 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. 77-GHz FOWLP MIMO AiP for Compact High-Resolution Radar With Horizontally and Vertically Long- and Medium-Range Sensing;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-04

2. 3D Stacking of Heterogeneous Chiplets on Modified FOWLP Platform with Thru-Silicon Redistribution Layer;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05

3. Comprehensive study on effect of chip layout and mold thickness on die shift and warpage for FOWLP applications;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

4. FEA simulation and modeling for fan-out package design;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

5. Comprehensive thermal investigation of Antenna in Package for SATCOM On The Move;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07

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