Author:
Chong Ser Choong,Wai Leong Ching Eva,Pei Siang Sharon Lim,Lim Siak Boon Simon,Chai Tai Chong
Cited by
7 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. State-Of-The-Art of Advanced Packaging;Chiplet Design and Heterogeneous Integration Packaging;2023
2. FEA simulation and modeling for fan-out package design;2022 IEEE 24th Electronics Packaging Technology Conference (EPTC);2022-12-07
3. Influence of height difference between chip and substrate on RDL in silicon-based fan-out package;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
4. Heterogeneous Integration for Chiplets on FOWLP Development Line;2022 IEEE 72nd Electronic Components and Technology Conference (ECTC);2022-05
5. Heterogeneous Integration on Fan-Out Wafer Level Packaging Platform;2021 IEEE 23rd Electronics Packaging Technology Conference (EPTC);2021-12-07