1. Development of Antenna on FO-WLP;soh;in proc 21st Electronic Packaging Technology Conference,2019
2. Demonstration of Vertically Integrated POP using FOWLP Approach
3. FOWLP Design for Digital and RF Circuits;guan;69th Electronic Components and Technology Conference (ECTC),2019
4. Millimeter-Wave Antenna in Fan-Out Wafer Level Packaging for 60 GHz WLAN Application;zihao;IEEE 68th IEEE Electronic Components and Technology Conference (ECTC),2018
5. Fan-Out Wafer Level Packaging Development Line;chai;Electronics Packaging Tech Conf,2020