Interfacial reaction and IMC growth between Sn-37 Pb and heterogeneous dual-phase substrate-Reference-Cited by-同舟云学术

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Interfacial reaction and IMC growth between Sn-37 Pb and heterogeneous dual-phase substrate

Published:2019-01 Issue: Volume:159 Page:112-124
ISSN:0042-207X
Container-title:Vacuum
language:en
Short-container-title:Vacuum

Author:

Cheng Jinxuan,Hu Xiaowu,Jiang Xiongxin

Funder

National Natural Science Foundation of China

Natural Science Foundation of Jiangxi Province

Publisher

Elsevier BV

Subject

Surfaces, Coatings and Films,Condensed Matter Physics,Instrumentation

Reference34 articles.

1. Microstructure and shear strength of Sn-37Pb/Cu solder joints subjected to isothermal aging;Hu;Microelectron. Reliab.,2014

2. Influence of initial morphology and thickness of Cu6Sn5 and Cu3Sn intermetallics on growth and evolution during thermal aging of Sn-Ag solder/Cu joints;Deng;J. Electron. Mater.,2003

3. Interfacial reaction and IMC growth between Bi-containing Sn0.7Cu solders and Cu substrate during soldering and aging;Hu;J. Alloy. Comp.,2014

4. The interfacial reaction between In-48Sn solder and polycrystalline Cu substrate during solid state aging;Tian;J. Alloy. Comp.,2018

5. Anisotropic grain growth and crack propagation in eutectic microstructure under cyclic temperature annealing in flip-chip SnPb composite solder joints;Liang;Scripta Mater.,2013

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2. Enhance mechanical property and electrical conductivity simultaneously of Sn–Cu–Co solder alloys by directional solidification;Journal of Materials Research and Technology;2024-03

3. Precipitation processes and phase interface structure of Ag3Sn during solidification of SnAg3Cu0.5/Cu solder joint;Vacuum;2024-01

4. Warping model of high-power IGBT modules subjected to reflow soldering process;International Journal of Mechanical Sciences;2023-08

5. Synergistic effects of alloy elements on the structural stability, mechanical properties and electronic structure of Ni3Sn4: Using first principles;Vacuum;2023-08

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