Author:
Liang Y.C.,Lin H.W.,Chen H.P.,Chen C.,Tu K.N.,Lai Y.S.
Subject
Condensed Matter Physics,General Materials Science,Mechanics of Materials,Metals and Alloys,Mechanical Engineering
Reference20 articles.
1. Future challenges in electronics packaging
2. SLT Device Metallurgy and its Monolithic Extension
3. Controlled Collapse Reflow Chip Joining
4. D.O. Powell, A.K. Trivedi, in: Proc. 43rd Electron. Compon. Technol. Conf., IEEE, New York, 1993, pp. 182.
5. R.K. Doot, in: Proc. 46th Electron. Compon. Technol. Conf., IEEE, New York, 1996, pp. 535.
Cited by
30 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献