Author:
Yuan Bo,Zhou Wenhao,Li Xuyang,Xie Yiqiu,Yin Xinpeng,Chen Xin,Shen Danyan,Wang Limin
Subject
Materials Chemistry,Surfaces, Coatings and Films,Surfaces and Interfaces,Condensed Matter Physics,General Chemistry
Reference60 articles.
1. A novel copper electroplating formula for laser-drilled micro via and through hole filling;Dow;Circuit World.,2004
2. Through-hole filling by copper electroplating;Dow;J. Electrochem. Soc.,2008
3. Through-wafer electroplated copper interconnect with ultrafine grains and high density of nanotwins;Xu;Appl. Phys. Lett.,2007
4. Fabrication of high aspect ratio 35 μm pitch through-wafer copper interconnects by electroplating for 3-D wafer stacking;Dixit;Electrochem. Solid-State Lett.,2006
5. Aspect-ratio-dependent copper electrodeposition technique for very high aspect-ratio through-hole plating;Dixit;J. Electrochem. Soc.,2006
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