Investigation of azathioprine and its local-structure molecules as levelers for through-holes copper electroplating-Reference-Cited by-同舟云学术

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Investigation of azathioprine and its local-structure molecules as levelers for through-holes copper electroplating

Published:2024-10 Issue: Volume:53 Page:105073
ISSN:2468-0230
Container-title:Surfaces and Interfaces
language:en
Short-container-title:Surfaces and Interfaces

Author:

Xiao Longhui,Li Qinyuan,Zeng Hong,Tian Ling,Huang Xin,Xie Jie,Zhang Han,He Wei,Liang Kun,Huang Qing,Chen Yuanming^ORCID

Publisher

Elsevier BV

Reference66 articles.

1. Study on the behaviors of Cu filling in special through-silicon-vias by the simulation of electric field distribution;Cao;Microelectron. Eng.,2014

2. Towards void-free copper filling of low-aspect-ratio heat dissipation through holes in packaging substrate with high H2SO4 concentration electroplating system;Wang;J. Ind. Eng. Chem.,2024

3. Interlayer cross-linked MXene enables ultra-stable printed paper-based flexible sensor for real-time humidity monitoring;Zhang;Chem. Eng. J.,2024

4. Effect of the macro- and microthrowing power of the electrolyte on the uniformity of distribution of electroplated copper in through-holes for PCB;Kosarev;J. Solid State Electrochem.,2021

5. Computational and experiments exploration of convection on Cu filling characteristics of multiple aspect-ratio micro through-holes;Wang;Electrochim. Acta,2022

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