A novel copper electroplating formula for laser‐drilled micro via and through hole filling
Author:
Publisher
Emerald
Subject
Electrical and Electronic Engineering,Industrial and Manufacturing Engineering
Reference10 articles.
1. Damascene copper electroplating for chip interconnections
2. Interactions Between Brightener and Chloride Ions on Copper Electroplating for Laser-Drilled Via-Hole Filling
3. Superconformal Electrodeposition in Submicron Features
4. Leveling of 200 nm Features by Organic Additives
5. Via-filling using electroplating for build-up PCBs
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3. Effects of 2,2-Dithiodipyridine as a Leveler for Through-Holes Filling by Copper Electroplating;Journal of The Electrochemical Society;2019
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