Investigation on synthesis and mechanism of a Sudan Ⅰ copper electrodeposition leveler based on influencing ion diffusion strategy-Reference-Cited by-同舟云学术

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Investigation on synthesis and mechanism of a Sudan Ⅰ copper electrodeposition leveler based on influencing ion diffusion strategy

Published:2024-08 Issue: Volume:227 Page:112156
ISSN:0143-7208
Container-title:Dyes and Pigments
language:en
Short-container-title:Dyes and Pigments

Author:

Zhou Wenhao,Yuan Bo,Li Xuyang,Zou Peikun,Du Kexin,Zhou Nayun,Wang Limin^ORCID

Publisher

Elsevier BV

Reference67 articles.

1. Development of different copper seed layers with respect to the copper electroplating process;Weiss;Microelectron Eng,2000

2. Study of microstructure and resistivity evolution for electroplated copper films at near-room temperature;Teh;Microelectron J,2001

3. Copper electroplating technique for efficient manufacturing of low-cost silicon interposers;Zhang;Microelectron Eng,2016

4. Through silicon via: from the CMOS imager sensor wafer level package to the 3D integration;Gagnard;Microelectron Eng,2010

5. Damascene copper electroplating for chip interconnections;Andricacos;IBM J Res Dev,1998

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