Synthesis and application of anthraquinone quaternary phosphonium salt electroplating copper leveler based on expanded electrostatic adsorption area strategy and physicochemical salt bridge mechanism-Reference-Cited by-同舟云学术

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Synthesis and application of anthraquinone quaternary phosphonium salt electroplating copper leveler based on expanded electrostatic adsorption area strategy and physicochemical salt bridge mechanism

Published:2024-08 Issue: Volume:664 Page:160259
ISSN:0169-4332
Container-title:Applied Surface Science
language:en
Short-container-title:Applied Surface Science

Author:

Li Xuyang,Chen Xin,Zou Peikun,Ye Renkui,Wang Limin^ORCID

Publisher

Elsevier BV

Reference48 articles.

1. Oxide electronics for 5G and 6G;Kyriacou;Nat. Electron.,2021

2. Electroforming in the Industry 4.0 era;Roy;Curr. Opin. Electrochem.,2020

3. Effects of additives with different acids on the through-silicon vias copper filling;Wang;Microelectron. Eng.,2018

4. Selective copper electroplating on patterned self-assembled monolayers for photovoltaic applications;Gay;ACS Appl Nano Mater,2022

5. A review on the fabrication and reliability of three-dimensional integration technologies for microelectronic packaging: Through-Si-via and solder bumping process;Cho;Metals,2021

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Synergistic effect of CTA+ and Br- on defect-free TSV filling by Cu electrodeposition;Electrochimica Acta;2024-11

2. Novel suppressor for damascene copper electrodeposition: Thioether-modified polyether with enhanced adsorption through an adjustable synthesis strategy;Electrochimica Acta;2024-11

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