Selective Copper Electroplating on Patterned Self-Assembled Monolayers for Photovoltaic Applications

Author:

Gay Julien1ORCID,Lachowicz Agata1,Blondiaux Nicolas1,Andreatta Gaëlle A. L.1ORCID

Affiliation:

1. Centre Suisse d’Electronique et de Microtechnique (CSEM) S.A., Jaquet Droz 1, 2002Neuchâtel, Switzerland

Funder

Schweizerischer Nationalfonds zur F?rderung der Wissenschaftlichen Forschung

Publisher

American Chemical Society (ACS)

Subject

General Materials Science

Reference43 articles.

1. Self-assembled monolayers in organic electronics

2. Modifying the Surface Properties of Indium Tin Oxide with Alcohol-Based Monolayers for Use in Organic Electronics

3. Transparent In-Ga-Zn-O field effect glucose sensors fabricated directly on highly curved substrates

4. Lachowicz, A.; Badel, N.; Gay, J.; Andreatta, G.; Blondiaux, N.; Faes, A.; Wyss, P.; Geissbühler, J.; Juan J, D. L.; Zhao, J.; Descoeudres, A.; Paviet-Salomon, B.; Ballif, C. In Reinforcement of Screen-Printed Copper Paste by Electrodeposited Copper for Metallization of Silicon Heterojunction Solar Cells, 10th Metallization and Interconnection Workshop, Genk, Belgium, 2021.

5. Hydrophobic AlOx Surfaces by Adsorption of a SAM on Large Areas for Application in Solar Cell Metallization Patterning

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1. Investigating the edge effects of Cu electroplating on the SAMs-coated Si substrate;Journal of Materials Science: Materials in Electronics;2023-04

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