Analysis of the BGA solder Sn–3.0Ag–0.5Cu crack interface and a prediction of the fatigue life under tensile stress
Author:
Publisher
Elsevier BV
Subject
Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,Modelling and Simulation
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2. Effect of Warpage on Solder Joint Fatigue Life by Influencing the Solder Joint Shape in BGA Packages;IEEE Transactions on Components, Packaging and Manufacturing Technology;2024-04
3. Finite Element Simulation of Sn-Ag-Cu Solder Joint Reliability Under Thermoelectric Coupling;Journal of Electronic Materials;2023-08-29
4. Structural optimization of thermal stresses in BGA solder joints based on improved BP neural network-genetic algorithm;The European Physical Journal Plus;2023-08-14
5. Microstructures and shear strengths of W-ball solder joints aged under isothermal and cyclic thermal conditions;Journal of Materials Science: Materials in Electronics;2023-03
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