Fatigue life prediction of solder joints with consideration of frequency, temperature and cracking energy density

Author:

Lee J.H.,Jeong H.-Y.

Publisher

Elsevier BV

Subject

Industrial and Manufacturing Engineering,Mechanical Engineering,Mechanics of Materials,General Materials Science,Modeling and Simulation

Reference24 articles.

1. Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders;Andersson;Mater Sci Eng A,2005

2. High-speed bend test method and failure prediction for drop impact reliability;Seah;IEEE Electron Compon Technol Conf 56th,2006

3. Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability;Chen;Eng Fract Mech,2005

4. Thermal cycling aging effects on microstructural and mechanical properties of a single PBGA solder joint specimen;Pang;IEEE Trans Compon Pack Manuf Technol,2001

5. Solder joint fatigue in a surface mount assembly subjected to mechanical loading;Tamin;IEEE Trans Compon Pack Manuf Technol,2007

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