Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders-Reference-Cited by-同舟云学术

Comparison of isothermal mechanical fatigue properties of lead-free solder joints and bulk solders

Published:2005-03 Issue:1-2 Volume:394 Page:20-27
ISSN:0921-5093
Container-title:Materials Science and Engineering: A
language:en
Short-container-title:Materials Science and Engineering: A

Author:

Andersson C.,Lai Z.,Liu J.,Jiang H.,Yu Y.

Publisher

Elsevier BV

Subject

Mechanical Engineering,Mechanics of Materials,Condensed Matter Physics,General Materials Science

Reference24 articles.

1. IPC presentation on Current Trends and the Future of Lead-free Soldering in the U.S.A., 2000 www.leadfree.org.

2. IPC Roadmap: A Guide for Assembly of Lead-free Electronics, Draft IV, 2000.

3. A. Arbor, Lead-free Solder Project Final Report, NCMS Report 0401RE96, National Center for Manufacturing Sciences, 3025 Boarwalk, 1997.

4. B.P. Richards, C.L. Levoguer, C.P. Hunt, K. Nimmo, S. Peters, P. Cusack, Lead free soldering—An analysis of the current status of lead-free soldering, British Department of Trade and Industry Report, 1999.

5. Z. Lai, J. Liu, Integrity of lead-free solders—A multi-client research program on manufacturability, failure mechanism and reliability of lead-free solders, Status Report No. 1, IVF, 1999.

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