Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability
Author:
Publisher
Elsevier BV
Subject
Mechanical Engineering,Mechanics of Materials,General Materials Science
Reference28 articles.
1. Flip chip technologies;Lau,1995
2. Device interconnection technology for advanced thermal conduction modules;Ray;IEEE Trans Comp Hybrids Manufact Technol,1992
3. Ball grid array technology;Lau,1995
4. Effect of substrate flexibility on solder joint reliability;Liu;Microelectron Reliab,2002
5. Transition of MCM-C applications to MCM-L using rigid flex substrates;Keating;Microelectron Reliab,1999
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