Transition of MCM-C applications to MCM-L using rigid flex substrates-Reference-Cited by-同舟云学术

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Transition of MCM-C applications to MCM-L using rigid flex substrates

Published:1999-09 Issue:9 Volume:39 Page:1399-1406
ISSN:0026-2714
Container-title:Microelectronics Reliability
language:en
Short-container-title:Microelectronics Reliability

Author:

Keating James

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Surfaces, Coatings and Films,Safety, Risk, Reliability and Quality,Condensed Matter Physics,Atomic and Molecular Physics, and Optics,Electronic, Optical and Magnetic Materials

Reference7 articles.

1. Multichip Module Technologies and Alternatives;Doane,1993

2. Looking for the best MCM interconnect;Schreiber,1994

3. An investigation of the thermal relationship between packaging density and effective thermal conductivity in laminated printed wiring boards;Teerstra,1995

4. High Density SMT Assemblies Based on Flex Substrates;Larmouth,1996

5. Laminate based multichip modules for direct chip attachment;Sylvia,1997

Cited by 2 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Optimization and validation of thermal management for a RF front-end SiP based on rigid-flex substrate;Microelectronics Reliability;2016-10

2. Fracture mechanics analysis of the effect of substrate flexibility on solder joint reliability;Engineering Fracture Mechanics;2005-11

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